Led- diode

Key Attributes.

LED- Diode Active Components > Diodes > LED Infrared LED Chip Stands for IRED(Infrared Emitting Diode) Chip. The manufactured chip is used for IR Emitter, TV remote controller, optical switch, IR LAN, and for a module for wireless digital data communication. Visible LED Chip Stands for VLED (Visible Light Emitting Diode) Chip, whose color covers red, green and orange etc. This chip is assembled into lamp to be used for light source of indication or signal of various electric products . Semiconductor used for LED General Level GaP / GaN / GaAs / GaAIAs Green, Red/ Blue / Red Infrared / Red Infrared Super Level GaAIAs / GaAsP / GaN / InGaN / GaP Red / Red, Yellow / Blue / Green / Green Ultra Level GaAIAs / InGaAIP / GaN / InGaN Red / Yellow, Orange, Red / Blue / Green Color of LED by wavelengths LED is divided into General level, Super level, Ultra level, depending on the curving angle. 100mcd and under belongs to General level, 500mcd and under belonging to Super level, and 500mcd and over belongs to Ultra level. LED production process In-line process In-line processing consists of die bonding process and wire bonding process. These two processes are made automatically by automatic image recognition system. In die bonding process, it is important to place the chip on silver epoxy already spread on the center of the lead frame cup with proper pressure, on the other hand in wire bonding process, it is important to bond gold wire with electrode of the upper side of semiconductor and lead frame of one side with proper pressure to connect. Mold process Mold process is a process where the lead frame with the chip bonded is molded into epoxy. LED lamp is completed when idiomorph is spread automatically and the lead frame is soaked in the mold cup where epoxy is soaked, finally to be hardened in the electric oven. Test and classification process A process where of the electric and optical characteristics of LED are measured to classify depending on the performances. Tapping process A process where the LED lamp is formed and attached on the tape so that it can be used for the automatic inserter which allows electric devices to be inserted into the PCB board automatically.